REJE Offers: Load Port, SMIF Port, Frame Load Port, and Open Cassette Stage
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Load Port

 

REJE offers a complete portfolio of port solutions: Load Port, SMIF Port, Frame Load Port, and Open Cassette Stage.

REJE independently developed automated loading and unloading system for semiconductor wafers, featuring small footprint and high automation level,can effectively improveproduction line efficiency and reduce production costs.

 

FOUP Load Port

Load Port is designed to enable automatic loading and unloading of 8-inch and 12-inch wafers, ensuring wafer cleanliness throughout the manufacturing process. It interfaces with automated transportation systems such as AGVs and OHTs to enable automated transfer of wafer pods. The system is widely used with semiconductor process equipment, including lithography, etching, CVD, PVD, cleaning, inspection, and metrology.

SMIF Port

Used in semiconductor chip manufacturing production lines to realize automatic opening and closing of SMIF PODs, preventing wafer contamination, replacing manual loading and handling, connecting to OHT overhead crane systems to realize automatic loading, unloading and handling functions, meeting the automated production needs of Fab plants.

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Load Port Features

  • Mapping can detect wafer presence, stacking, and tilting.
  • It can be equipped with loading units that meet SEMI standards, such as FOUP, FOSB, and conversion platform + Cassette.
  • Equipped with carrier automatic identification function.
  • Optional RFID reader.
  • TCP/IP communication method.
  • Optional SECS/GEM interface.
  • Door holding uses vacuum adsorption method.
  • With anti-pinch function.
  • Operation cycle opening operation: 20s (including Mapping operation), closing operation 10s (excluding Mapping operation).

SMIF Port Features

  • SMIF Port is used to place and switch 125mm, 150mm, 200mm wafer SMIF Pods. The opening method is top opening.
  • Compliant with SEMI E63 standard, box switching time: Open Pod≤15s; Close Pod≤15s.
  • Using a single system mini-environment to isolate the wafer during transportation and prevent wafer contamination.
  • Replace manual loading and unloading, can be interfaced with OHT overhead crane system to realize automatic loading and unloading, and meet the needs of automated production in Fab factories.
  • It can realize the detection of the presence or absence of SMIF Pod, wafer and Cassette, and can also detect the convexity, obliqueness and thickness of the wafer.
  • Automatic identification of Cassette size and Cassette status detection function.
  • Optional RFID read-write unit (supports RS232 or Ethernet communication).
  • Can store 80 kinds of wafer MAP recipe parameters.
RJST10900

RJST10900

Applicable wafer sizes: 12-inch / 8-inch Product dimensions: 2605x1300x2235mm


Configuration: RFID, industrial control unit components, Wafer ID Reader, safety light curtain

RJST10400

RJST10400

Applicable wafer size: 12 inches Product dimensions: 1595x1301.5x2000mm


Configuration: Robot Mapping, RFID, Industrial PC components, Wafer ID Reader, E84, FOSB Detection, Safety Light Curtain

RJST10500

RJST10500

Applicable wafer sizes: 8-inch/6-inch Product dimensions: 1350x1298.5x2000mm


Configuration: RFID, industrial control unit components, Wafer ID Reader, safety light curtain

Taiko Sorter

Taiko Sorter

Applicable to Taiko wafers with dimensions: 300mm, thickness: 75μm Product dimensions: 2800x980x1891.5mm


Configuration: FLIP, RFID, industrial control unit components, Wafer ID Reader, E84, Info pad sensor, safety light curtain

SVAL3001

SVAL3001

Edge-grip vacuum aligner for susceptor tray (compound semiconductors and Si wafers). High-speed and high-accuracy alignment is available.


Environment:Vacuum area (Temp. 15°C to 50°C) Wafer Size:100 to 300mm, others Carrying Object:silicon wafer, susceptor

SAL20C1

SAL20C1

Designed for aligning wafers in a production line or inspection line of semiconductor. Edge grip type aligner minimizes the wafer contact.


Environment:Clean room atmosphere Wafer Size:300 mm Carrying Object:Silicon wafer

SAL3264HV

SAL3264HV

New type of aligner available for any material of wafer for 2, 3 inch, 100 to 150 mm waferl.


Environment:Clean room atmosphere Wafer Size:2, 3 inch, 100 to 150 mm Carrying Object:Transparent, translucent, or silicon wafer

SAL3484HV

SAL3484HV

New type of aligner available for any material of wafer for 100 to 200 mm wafer


Environment:Clean room atmosphere Wafer Size:100 to 200 mm Carrying Object:Transparent, translucent, or silicon wafer

GTFR5280

GTFR5280

Environment:Clean room atmosphere Arm:Single arm Operating Range:553 mm (3rd joint center) Vertical Stroke:320 mm Payload Capacity:Below 4kg (calculated for the arm 3rd joint)


5-Axis horizontal and multi-joint type clean robot for 300 mm wafer. A twin end-effector mounted on its single-arm has the same function as a twin-arm robot. Designed for handling wafers in EFEM. Compared to our conventional GTCR model, the cycle time is improved by reducing the operation prohibited area and the influence of speed limit. Suitable for internal use in 300mm semiconductor production equipment, and applicable to wafer handling for EFEM.

MTCR4160

MTCR4160

Environment:Clean room atmosphere Arm:Twin arm Operating Range:315mm (3rd joint center) Vertical Stroke:300mm / 400mm / 500mm Payload Capacity:4kg (calculated for the arm 3rd joint)


Designed for handling 300mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MTHR type. Certified CE marking. Execution of origin search is not required by using the servo motors with absolute encoders.

STCR4130SN-300-CM-X1000

STCR4130SN-300-CM-X1000

This robotic arm is based on the cylindrical coordinate Clean Robot, with the addition of a horizontal axis, with a maximum reach of 3000mm. The horizontal axis can be mounted on the bottom or side.


Object to be moved: ~300mm Wafer Cleanliness: 1S0 standard Class 1, under independent exhaust conditions inside the drive structure

STCR4200SN-1300-PM-X520

STCR4200SN-1300-PM-X520

This robotic arm is based on the cylindrical coordinate Clean Robot, with the addition of a vertical axis and a horizontal axis. The vertical axis has a maximum stroke of 2000mm, and can be customized according to customer needs. This product has been used in large quantities by clients.


Object to be handled: ~300mm Wafer Cleanliness: ISO standard Class 1, under the condition of independent exhaust of the drive structure.

Frame Load Port

Frame Load Port

Frame Load Port Applicable wafer sizes: 12-inch/8-inch


Product dimensions: 472x598.5x1348mm Configuration: RFID, E84, Mapping, Fly out

RJLP300

RJLP300

Load Port Applicable wafer sizes: 12-inch/8-inch


Product dimensions: 472x564.5x1348mm Configuration: RFID, E84, Mapping, Fly out

RJLP10800

RJLP10800

SMIF Port Applicable wafer sizes: 8-inch/6-inch/5-inch


Product dimensions: 472x412x1347mm Configuration: RFID, E84, Wafer Mapping, Wafer, Protrusion, Bevel/Stack identification function

RJLP11200

RJLP11200

SMIF Port Applicable wafer size: MASK(RSP150)


Product dimensions: 472x412x1347mm Configuration: RFID, E84, MASK Mapping, Carrier Present

RJLP10200

RJLP10200

Open Cassette Stage Applicable wafer sizes: 8-inch/6-inch/4-inch


Product dimensions: 470x390x1348mm Configuration: E63 interface, wafer die detection, wafer size detection

RJLP500

RJLP500

Open Cassette Stage Applicable wafer sizes: 8-inch/6-inch


Product dimensions: 470x390x1348mm Configuration: E63 interface, wafer die detection, wafer size detection

Precision Ceramics

Precision Ceramics

Fabricated from refined synthetic materials like alumina and silicon carbide, delivering outstanding wear resistance, insulation, heat resistance, corrosion resistance and electrical conductivity.


Bionic Anti-Friction Pad

Bionic Anti-Friction Pad

High horizontal friction, no pop-out, contamination-free.Made of self-developed semiconductor compliant materials for semiconductor & display substrate sectors.


Heater

Heater

New integrated process enables easy mounting & removal, convenient maintenance and superior operability.


Metal Heater

Metal Heater

Provides uniform high-temperature vacuum heating for 4–12 inch silicon wafers, with custom options for substrate brackets, heating trays and more.


TC Wafer

TC Wafer

Adopting new integrated craftsmanship, it enables easy heater mounting & removal, convenient maintenance and great operability.


O Ring

O Ring

High temperature resistant, pressure resistant, and plasma resistant.