REJE AUTOMATION's 200mm wafer thinning and dicing system won the third prize of the 2015 Capital Workers' Independent Innovation Achievement Award
2017-03-06
REJE's independently developed and innovative domestical-produced 200mm thinned wafer dicing machine system won the third prize of the 2015 Capital Workers' Independent Innovation Achievements Award, jointly awarded by the Beijing Municipal Federation of Trade Unions and the Beijing Municipal Science and Technology Commission.
The 200mm thinned wafer dicing machine project is a semiconductor industry equipment specifically designed for thinned wafers with dicing/packaging/unpacking functions. It aims to solve the problems of low efficiency and high error rate in manual transfer and dicing of thinned wafers in the semiconductor chip (dicing) process, providing domestic semiconductor equipment for the wafer manufacturing field.
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