REJE provides customized solutions and maintains extensive cooperation with industry-leading companies such as JEL and ASUZAC.
Aligner
Aligner is designed for wafer centering, alignment, and notch and flat finding in semiconductor manufacturing processes, suitable for integration into semiconductor production equipment, testing equipment, etc. It ensures the precise position and orientation of wafers during processing, thereby improving production efficiency and product quality.
Flexible customized design can be provided according to the size, material, transparency, and warp value of customer wafers.
Gripping methods include vacuum adsorption, Bernoulli adsorption, and edge clamping.
Product selection reference
Object to be handled
100-300mm SEMI Standard Wafer (transparent, translucent, silicon wafer)
(Others can provide flexible customized design for customers according to the shape and material of special wafers)
Time required for position determination
Positioning wafer notch 3Sec (excluding wafer picking and placing time)
Positioning accuracy
Wafer center: ±0.1mm
Wafer missing edge (notch): ±0.1 degree
Sensor
LED lighting + image recognition sensor method is used to detect the wafer edge
Wafer size switching
Command control method or communication method
Cleanliness
IS014644 Class1 (under the condition of independent exhaust of the drive structure)
Factory services
Power supply: DC24V ±10%3A Vacuum: -53kpa and above
Edge-grip vacuum aligner for susceptor tray (compound semiconductors and Si wafers). High-speed and high-accuracy alignment is available.
Designed for aligning wafers in a production line or inspection line of semiconductor. Edge grip type aligner minimizes the wafer contact.
New type of aligner available for any material of wafer for 2, 3 inch, 100 to 150 mm waferl.
New type of aligner available for any material of wafer for 100 to 200 mm wafer
New type of aligner available for any material of wafer for 200 to 300 mm wafer.
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