| Products | EFEM System
Domestic High-precision Semiconductor Automation Reliable Choice
High Cleanliness, High Reliability, Hodular Design
The REJE EFEM System is pre-process wafer transfer units for semiconductor process equipment,
mainly completing the automated wafer transfer to other process equipment.
Product series matches mainstream wafer sizes in the industry: 12-inch/8-inch/6-inch/4-inch.
Core Component Development and Customization Meet Diverse Needs
Multiple loading units can be configured, and loading units that meet SEMI standards such as FOUP, FOSB, and Open Cassette can be equipped. Mixed and matched configurations of loading units are also possible. Strict quality control and screening ensure stable and controllable performance.
Optional Configuration
Robot Mapping, RFID, Industrial PC components, WaferlD Reader, E84, FOSB Detection, Safety Light Curtain, FLIP Axis, Camera
REJE EFEM Features
- Equipped with a Wafer lD Reader module developed by REJE brand, it can accurately and efficiently read barcodes, QR codes, numbers and letters on wafers of various materials/sizes, achieving a maximum reading rate of 36000 Pcs/H and a recognition accuracy of over 99.9%.
- The robot wafer transfer efficiency can reach 860 Pcs/h.
- Repeatability accuracy within ±0.05mm.
- Aligner calibration accuracy can reach within ±0.05mm of the wafer center, and within ±0.1° of the wafer flat edge (notch), alignment time ≤3s.
- End-Effector can use various wafer fixing methods such as vacuum suction, bottom support, edge clamping, and Bernoulli non-contact type.
- The End-Effector material is high-purity ceramic, and conductive Teflon coating surface treatment is optional.
- The End-Effector is equipped with a flipping mechanism, which can realize any angle flipping of the wafer between 0-180°.
Core Technology
- Corresponding to E84, it can communicate with EAP via SECS/GEM.
- The product structure has been specially designed and equipped with a micro-environment maintenance system to achieve Class 1 cleanliness requirements.
- The ion bar inside the equipment can eliminate static electricity on the wafer surface.
- Industrial control computer + Windows system.
- High domestication rate of core parts, the whole machine adopts modular design, provides a variety of optional functional configurations, and quickly responds to customer needs.
- It can be connected to various process equipment of different types, and can be deeply customized according to process needs.
EFEM Overall Reliability
Key Indicators
Specifications / Parameters
MTBF (Mean Time between Failures)
> 4000 Hours
MTTR (Mean Time to Repair)
< 8 Hours
Wafer Dropping / Breaking Rate
< 1/100000 Pcs
UPTIME
> 99%
MTBC (Mean Time between Maintenance)
> 12 Months
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