Premium Parts
Focus on high-end, reliable, and sophisticated technology products to solve problems encountered in technology research and development, and improve the quality and productivity of complex industrial processes. Customized solutions and designs for new materials, instruments and mechanical equipment to meet different process needs and continuously enrich the categories that can meet market demand.
Maintain innovation and flexibility, and win customer trust with advanced technical support and perfect customer service.
Semiconductor Equipment Parts
High-quality Customized Solutions
Electric Heater
Heating and insulation of exhaust system piping for semiconductor manufacturing equipment, and heating of various vacuum equipment.
TC Wafer
Obtain the actual temperature of specific locations on the wafer and the overall temperature distribution of the wafer.
Fine Ceramic Product
TESSEDY offers a wide range of products to suit various usage environments, specifications, and shapes. You can choose from a wide variety of handling fingers according to your purpose, use, and material.
Pressure Sensor
Control of various pressures (supply/exhaust, atmospheric pressure recovery, leakage, cleaning), vacuum pressure, and various molding loads (surface, grinding, assembly).
Non-Slip Pad
MEMS micro-texture structure, customizable products, global standard quality control for precision polymer processes, ultra-cleanliness and contamination (particle) control.
SP Lifter
Suitable for the semiconductor and power industries, improving operability and safety, energy saving, spring unit for cover opening and closing.
Coating
Provide suitable surface treatment solutions based on customer needs, from small batches to mass production, and can handle items with complex shapes.
Reducer
Reducers are widely used in six-axis robots, four-axis robots, collaborative robots, SCARA robots, printing equipment, CNC machine tools, and other high-precision automated equipment.
Thermal Silicon Pad
Control of various pressures (supply/exhaust, atmospheric pressure recovery, leakage, cleaning), vacuum pressure, and various molding loads (surface, grinding, assembly).
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