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SAL20C1
(Edge-grip type)Wafer Aligner
Designed for aligning wafers in a production line or inspection line of semiconductor.
Edge grip type aligner minimizes the wafer contact.
Product Features
Environment:Clean room atmosphere
Wafer Size:300 mm
Carrying Object:Silicon wafer
Product Details
- High-speed, high-precision positioning of the center and edge defects of semiconductor silicon wafers by clamping the wafer edge.
- Avoid particle contamination caused by surface friction.
- Control communication methods: RS232C and parallel I/O
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