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SEMICON China 2025 | REJE AUTOMATION showcases its full range of products, demonstrating its diverse competitiveness

2025-03-31


REJE Automation SEMICON China 2025 exhibition concluded successfully.

In the third spring month in Shanghai, after the rain clears, and talented people emerge, competing in the sounds of spring.

From March 26th to 28th, 2025, SEMICON China 2025, themed "Cross-border Global, Heart-to-Heart Connection," was grandly held at the Shanghai New International Expo Center. Beijing REJE Automation Co., Ltd. appeared at the conference and set up a dedicated booth, showcasing a full range of products including Clean robots, EFEM/Sorter, Load Port/SMIF Port, and Parts.

 

For a better on-site product experience! We brought more technical experts for physical equipment.

As a leading brand of semiconductor automated transfer equipment with more than ten years of business, REJE AUTOMATION's booth attracted many industry experts and partners to inquire about and experience product performance, and received widespread recognition.

Let's take a look at the highlights of the scene!

Clean Robot

PLP Handling Robot - JEL JFR Series

■ High-speed, low-vibration handling; 
■ The maximum size of PLP is 600mm x 600mm, the maximum weight is 4kg, and the maximum size and maximum weight can be used simultaneously;

■ The robot arm has a horizontal multi-joint structure and can handle 2 Ports;

■ The robot finger is equipped with a non-contact calibration function; 
■ The position of the object to be handled can be determined only by the robot arm.

■ Applicable sizes:

510mm x 515mm, 600mm x 600mm;

Maximum applicable weight: 4kg/maximum thickness 3mm.

■ Fixing method:

Vacuum suction (other methods can also be used for fixing).

 

Robot arm suitable for vacuum environment and cylindrical coordinate workstation layout - JEL SVCR3000 series

A best-selling 3-axis cylindrical coordinate single-arm clean robot arm, with good stability and high cost performance, can also be used for tray handling.

Core Technology/Parameters:

■ Suitable for vacuum environments and cylindrical coordinate workstation layouts;

■ Uses stepper motors, high safety, high stability;

■ Magnetic fluid sealing is used at the arm joints;

■ Vacuum seal: magnetic fluid sealing device and bellows;

■ Handling weight: 2kg or less at the base of the third arm joint;

■ Repeat positioning accuracy within ±0.1mm;

■ Maximum speed: arm axis 550mm/s, rotary axis 170mm/s, lifting axis 30mm/s;

■ Vacuum resistance 1.33 x 10^-6Pa.

 

EFEM System

Various loading units can be configured, and loading units conforming to SEMI standards such as FOUP, FOSB, and Open Cassette can be mounted. Mixed configuration of Lord Port and SMIF Port is also possible.

This product is a wafer transfer unit in front of semiconductor process equipment, mainly completing the automated transfer of wafers to other process equipment.

The product structure is specially designed and equipped with a micro-environment maintenance system to achieve Class 1 cleanliness requirements.

Core Technology/Parameters:

■ Equipped with a Wafer ID Reader module, it can accurately and efficiently read barcodes, QR codes, numbers, and letters on wafers of various materials/sizes, achieving a maximum reading rate of 36000 Pcs/H and a recognition accuracy of over 99.9%;

■ Wafer transfer efficiency of the robot arm can reach 150 wafers/h;

■ Repeatability within ±0.1mm;

■ Aligner calibration accuracy can reach within ±0.1mm of the wafer center, ±0.1 degrees of the wafer flat edge (notch), and alignment time ≤3s;

■ End-Effector can use various wafer fixing methods such as vacuum suction, bottom support, edge clamping, and Bernoulli non-contact;

■ End-Effector material is high-purity ceramic, and u conductive Teflon coating surface treatment is optional;

■ The End-Effector is equipped with a flipping mechanism, which can realize any angle flipping of the wafer between 0-180 degrees.

 

Parts

■ Finger series vacuum suction/Bernoulli/edge clamping/bottom support fingers;

■ Ceramic products, support customized designs;

■ Pressure sensors & load cells control various pressures (supply/exhaust, atmospheric pressure recovery, leakage, cleaning), vacuum pressure, and various molding loads (surface, grinding, assembly);

■ High-polymer anti-slip pads back-adhesive type, embedded type, O-ring type, special shapes;

■ Heater products jacket type/strip type/film type/silicone rubber heater, insulation belt, temperature controller, insulation heat insulation material;

■ High corrosion resistance & high hardness coating fluoroplastic coating, ceramic coating, ceramic + PTFE composite coating.

 

To date, REJE Automation has served more than 800 manufacturers and provided more than 10,000 units/sets of products. With careful thinking, creation, and service, we not only manufacture stable and reliable products, but also strive to provide users with a comprehensive and excellent user experience. 
In the future, REJE Automation will actively expand domestic and international markets and continue to strive to become a world-leading manufacturer of key semiconductor component solutions.