REJE offers customized solutions and collaborates extensively with leading industry players such as JEL and ASUZAC.
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GCR4280
4-Axis Horizontal and Multi-Joint Type Clean Robot (For large diameter wafer)
Environment:Clean room atmosphere
Arm:Single arm
Operating Range:553mm (3rd joint center)
Vertical Stroke:300mm / 420mm
Payload Capacity:Below 4kg (calculated for the arm 3rd joint)
Product Features
Designed for handling large diameter wafer in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.
Product Details
- 3 FOUP access is available for robot only (for 300mm wafer). 2 FOUP access is available without a track for 450mm wafer.
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- AC servo motors with absolute encoders installed in all axes.
- High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
- Wafer holding: end-effector with vacuum suction, passive edge, or edge grip.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
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