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SVCR3260

3-axis cylindrical coordinate vacuum Clean Robot

Environment:Vacuum (Temp. 15°C to 50°C) Driving unit:lean room atmosphere (Temp. 15°C to 40°C) Arm:Single arm Operating Range:520mm (3rd joint center) Vertical Stroke:20mm / 40mm Payload Capacity:2kg (calculated for the arm 3rd joint)

Product Features

Designed for handling wafers in the vacuum chamber of production line and inspection line. Double payload and superior cost performance compared to SVHR series. Compatible with SVHR series and it is possible to replace or upgrade into SVCR series.

Product Details

  • Magnetic fluid sealing is used for arm joint.
  • acuum sealing: Magnetic fluid sealing and bellows are used.
  • For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • 2-phase stepping motor installed in all axes.
  • Servo motor type is available.
  • High-speed, high-accuracy wafer handlingby S-curved speed control.
  • Wafer holding: end-effector with passive edge or edge grip type End-effector.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

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