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MCR3160C

3-Axis Cylindrical Coordinate Clean Robot

Environment:Clean room atmosphere Arm:Single arm Operating Range:400mm (3rd joint center) Vertical Stroke:300mm / 400mm / 500mm Payload Capacity:4kg (calculated for the arm 3rd joint)

Product Features

Designed for handling 300mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MHR type. Execution of origin search is not required by using the servo motors with absolute encoders.

Product Details

  • Base or flange mounting type is selectable.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • AC servo motors with absolute encoders installed in all axes.
  • High-speed, high-accuracy wafer handlingby S-curved speed control.
  • Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

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