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SCR3160CS
3-Axis Cylindrical Coordinate Clean Robot
Environment:Clean room atmosphere
Arm:Single arm
Operating Range:340mm (3rd joint center)
Vertical Stroke:200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm
Payload Capacity:3kg (calculated for the arm 3rd joint)
Product Features
Designed for handling small wafers in a production line or inspection line of semiconductor.
Product Details
- Arm lineup: 100mm, 130mm, 160mm, 200mm
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- 2-phase stepping motor installed in all axes.
- High-speed, high-accuracy wafer handlingby S-curved speed control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
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